Vecow
AI Computing System
AI Computing Systems by Vecow are advanced, ruggedized solutions designed for high-performance AI applications at the edge. These systems integrate powerful NVIDIA GPUs and optimized hardware to enable real-time data processing, deep learning, and machine vision in demanding environments. Built for industrial durability, they operate reliably in extreme temperatures, vibrations, and shock-prone settings. Ideal for autonomous vehicles, smart cities, and industrial automation, Vecow’s AI systems support scalable, low-latency decision-making with robust connectivity options like PoE, CAN, and 5G. Their modular designs ensure adaptability across sectors like transportation, robotics, and smart manufacturing, delivering seamless AI deployment where reliability and efficiency are critical.
Vecow MIG-3000
The Vecow MIG-3000 Series is a compact, high-performance AI computing platform built with 14th Gen Intel® Core™ processors and designed to support discrete GPUs. With support for dual DDR5 memory up to 64GB, PCIe x16 expansion for long graphics cards (up to 900W), and wide-range DC power input, it is ideal for advanced applications like Machine Vision, Medical Imaging, Fleet Management, and AIoT solutions. Its rugged construction and extended temperature support ensure reliable performance in challenging environments.

Technical specifications
Category | Specification |
---|---|
Processor | Intel® Core™ i9/i7/i5/i3 (12th/13th/14th Gen) Up to 24-core CPUs Supports max TDP 65W |
Chipset | Intel® H610E |
Memory | 2x DDR5 4800MHz SO-DIMM Up to 64GB |
Graphics | Integrated: Intel® UHD Graphics 770/730 Discrete GPU: Supported via PCIe x16 (up to 900W) |
Display Outputs | 1x HDMI 1.4 (3840x2160 @30Hz) 1x DisplayPort 1.2a (3840x2160 @60Hz) |
Storage Options | 1x M.2 Key M (2242/2280, PCIe x4/SATA) 2x SATA III |
Expansion | 1x PCIe 4.0 x16 (for 2-slot long GPU) 1x M.2 Key E (2230, PCIe x1/USB2) |
USB Ports | 2x USB 3.2 Type-A 2x USB 2.0 Type-A |
Serial Ports | 2x COM RS-232/422/485 |
LAN | 1x Intel® I219V Gigabit LAN 1x Intel® I225LM 2.5G LAN |
Audio | Realtek® ALC897, 7.1 HD Audio 1x Mic-in, 1x Line-out |
TPM | Infineon SLB9670, TPM 2.0, SPI interface |
Power Input | DC 9V to 55V (2-pin Terminal Block) |
OS Support | Windows 11/10, Linux |
Mounting | Wallmount via mounting brackets |
Dimensions | 162.7mm x 203.0mm x 385.0mm (6.41" x 7.99" x 15.16") |
Weight | 5.3 kg (11.45 lbs) |
Operating Temp. | 0°C to 60°C (32°F to 147°F) |
Storage Temp. | -20°C to 80°C (-4°F to 176°F) |
Humidity | 5% to 90% RH, non-condensing |
Certifications | CE, FCC, ICES, EN50155, EN50121-3-2 Shock/Vibration: IEC 61373:2010 |
High-Performance Fanless Systems
Vecow’s High-Performance Fanless Systems are rugged, industrial-grade solutions engineered for mission-critical applications in extreme environments. Combining powerful Intel® or ARM processors with fanless thermal design, these systems deliver reliable, maintenance-free operation in temperatures ranging from -40°C to 70°C. Built to withstand shock, vibration, and dust, they excel in industrial automation, transportation, and smart infrastructure. Equipped with versatile I/O (PoE, COM, DIO) and advanced connectivity (5G, M12), they enable real-time edge computing, IoT integration, and data-intensive tasks. Vecow’s fanless systems prioritize durability, low power consumption, and compliance with MIL-STD standards for seamless, fail-safe performance.
Vecow ECX-4000
The Vecow ECX-4000 is a rugged, high-performance fanless embedded system built for next-generation edge AI applications. Powered by Intel® Core™ Ultra 200S processors (Arrow Lake-S) with up to 24 cores and integrated AI acceleration (NPU + Intel® Xᵉ Graphics), it delivers up to 36 TOPS of AI performance. Designed for in-vehicle computing, public safety, intelligent logistics, and industrial automation, the ECX-4000 combines powerful compute capabilities with versatile connectivity, real-time features, and robust environmental tolerance.

Technical specifications
Category | Specification |
---|---|
Processor | Intel® Core™ Ultra 200S Series (Arrow Lake-S), up to 24 cores (P-core + E-core hybrid), up to 65W TDP |
Integrated AI | Intel® NPU (AI Boost), up to 36 TOPS; Intel® Xᵉ LPG Graphics with up to 4 engines |
Memory | 2x DDR5 6400MHz CSODIMM, up to 96GB (ECC/non-ECC) | Display Outputs | 2x DisplayPort (8K), 1x HDMI 2.0 (4K), 1x DVI-I (Full HD) |
Ethernet Ports | - Up to 9 total LAN ports: • 2x 10G SFP+ (Intel® X710) • 4x 2.5G PoE+ (IEEE 802.3at) • 3x 2.5G LAN • 1x GigE with iAMT support |
USB Ports | 6x USB 3.2 Gen 2 |
Serial Ports | 4x COM (RS-232/422/485) |
Digital I/O | 16x Isolated DIO (8 DI / 8 DO, optional) |
Storage Options | 2x 2.5" SATA III SSD trays (front-access), optional 2x M.2 front-access sockets, 1x internal M.2 2280 (PCIe x4) |
Expansion Slots | 2x M.2 Key B, 1x M.2 Key E, Optional SUMIT A & B |
Wireless Support | 5G / WiFi 7 / BT / 4G / LTE / GPRS / UMTS via M.2 & SIM slots |
Audio | Realtek® ALC888S-VD, 7.1 CH HD Audio (1x Mic-in, 1x Line-out) |
Power Input | Dual DC 9V–50V (Redundant), 3-pin Terminal Block |
Ignition Control | 16-mode Software Ignition, Remote Power Switch |
Security/Manageability | TPM 2.0, Intel® vPro, TSN, TCC, PXE, Wake-on-LAN, Watchdog Timer |
OS Support | Windows 11/10, Linux |
Certifications | CE, FCC, ICES, EN50155, EN50121-3-2 |
Environmental | - Operating Temp: -40°C to 75°C (varies by model
& CPU TDP) - Storage Temp: -40°C to 85°C - Humidity: 5%–95% (non-condensing) |
Shock/Vibration | Shock: 50G @ wallmount, IEC 60068-2-27 Vibration: 5Grms, IEC 60068-2-64 |
Dimensions | 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11"), Weight: 3.8kg |
Mounting Options | Wallmount (default), optional DIN Rail and 2U Rackmount |
Ultra-Compact Embedded Systems
Vecow’s Ultra-Compact Embedded Systems offer space-efficient, high-reliability computing solutions for edge applications in constrained environments. Designed with rugged, fanless architectures, these systems operate seamlessly in extreme temperatures (-40°C to 70°C) and withstand shock, vibration, and dust. Powered by Intel® or ARM processors, they deliver robust performance for real-time data processing, IoT integration, and industrial automation. Compact yet feature-rich, they include versatile I/O (PoE, USB, COM) and modern connectivity (5G, Wi-Fi, M12) for smart factories, autonomous mobile robots, and transportation. MIL-STD certified and energy-efficient, Vecow’s ultra-compact systems ensure fail-safe operation in harsh settings like logistics, energy, and public infrastructure, balancing power with minimal footprint.
Vecow ECS-4700
The Vecow ECS-4700 is an EN60945-certified, fanless rugged embedded system designed for AI and edge computing in harsh marine and industrial environments. Featuring 13th Gen Intel® Core™ i7/i5 processors with built-in AI acceleration and up to 96GB DDR5 memory, the ECS-4700 ensures high performance, reliability, and extended connectivity. With its isolated power input, PoE+ support, EN60945 compliance, and wide temperature operation, it's built for mission-critical applications including marine, transportation, and industrial automation.

Technical specifications
Category | Specification |
---|---|
Processor | 13th Gen Intel® Core™ i7-1370PE, 14-core (Raptor Lake-P), 28W TDP |
Chipset | Intel® SoC |
Graphics | Intel® Iris Xe Graphics, 4K support via DP/HDMI/USB-C |
Memory | Up to 96GB DDR5 5200MHz SO-DIMM (2 slots) |
Storage | - 2x Front-access 2.5” SATA III SSD/HDD trays (RAID 0/1) - 1x M.2 Key M (PCIe x4) |
Expansion Slots | - 1x M.2 Key B (5G/4G, SIM slot) - 1x M.2 Key E (WiFi) |
Display Outputs | - 2x DisplayPort 1.4a - 1x HDMI 2.0 - 1x DP via USB Type-C |
USB Ports | - 2x USB 3.2 Gen 2 Type-A - 1x USB 3.2 Gen 2x2 Type-C - 2x USB 2.0 |
Serial Ports | 4x COM RS-232/422/485 |
DIO | 16 Isolated DIO (8 DI / 8 DO) |
LAN Ports | - 2x 2.5GigE (Intel® I226, TSN support) - 4x PoE+ GigE (Intel® I350, 25.5W each, 35W total budget) |
Wireless Support | Supports 5G, WiFi, 4G/LTE, GPRS, UMTS via SIM and M.2 |
Audio | Realtek ALC888S-VD, 7.1 HD Audio, 1x Mic-in, 1x Line-out |
Power Input | Dual Redundant DC 9V–50V, Software Ignition Control |
Certifications | EN60945, EN50155, EN50121-3-2, CE, FCC |
OS Support | Windows 11/10, Linux |
Security & Manageability | TPM 2.0 (Infineon SLB9672), Intel vPro, TSN, TCC, Wake-on-LAN, PXE |
Dimensions | 256.8mm x 141.0mm x 54.9mm (10.11" x 5.55" x 2.16") |
Weight | 2.2kg (4.8 lbs) |
Mounting Options | Wall mount (default), Optional VESA/DIN rail mount |
Operating Temp. | -25°C to 75°C (fanless, with airflow) |
Storage Temp. | -40°C to 85°C |
Humidity | 5% to 95%, non-condensing; 95% @ 75°C |
Shock/Vibration | IEC 60068-2-27 (Shock), IEC 60068-2-64 (Vibration) |
AI & Vision Support | Fully supports Intel® OpenVINO Toolkit, GigE Vision, USB Vision |
Expandable Fanless System
Vecow’s Expandable Fanless Systems are modular, rugged computing solutions designed for scalable industrial applications in extreme environments. Featuring a fanless, dustproof design, these systems operate reliably in temperatures from - 40°C to 70°C, with resistance to shock, vibration, and humidity. Built with Intel® processors and PCI/PCIe expansion slots, they support customizable I/O (PoE, USB, COM, DIO) and advanced connectivity (5G, M12) for edge computing, machine vision, and AIoT deployments. Vecow’s expandable systems offer flexible upgrades, MIL-STD compliance, and robust power efficiency. Their adaptable architecture ensures seamless integration in harsh settings, balancing high performance with future-proof scalability.
Vecow ECX-3200
The Vecow ECX-3200/3100 Series is a high-performance, fanless embedded computer platform designed for harsh industrial environments and demanding workloads. Powered by 14th/13th/12th Gen Intel® Core™ processors and Intel® R680E chipset, it supports up to 96GB DDR5 memory, rich I/O, wide power input, advanced PoE+, PCIe expansion, and operates in extreme temperatures. Ideal for Machine Vision, AI at the Edge, Smart Retail, Rolling Stock, and Vehicle Computing.

Technical specifications
Category | Specification |
---|---|
Processor | Intel® Core™ i9/i7/i5/i3 (14th/13th/12th Gen, up to 24 cores) |
Memory | 2x DDR5 5200MHz SO-DIMM, up to 96GB |
Graphics | Intel® UHD 770/730 (Xe Architecture), 1x DVI-I, 1x HDMI, 2x DisplayPort |
LAN Ports | 4x 2.5GigE PoE+ (IEEE 802.3at), 2x GigE LAN |
USB Ports | 6x USB 3.2 Gen 2 Type-A, 1x USB 3.2 Gen 2x2 Type-C (20Gbps, 15W) |
Serial Ports | 4x COM (RS-232/422/485) |
Expansion Slots | 1x PCIe x16 (up to 200W), 2x M.2 Key B, 1x M.2 Key E, 1x M.2 Key M, 1x Mini PCIe |
DIO | 32 Isolated DIO (16 DI / 16 DO) |
SIM Slots | 3x Nano SIM (External) |
Storage Options | 2x SATA III (6Gbps), 2x 2.5” SSD/HDD trays, 1x M.2 Key M (PCIe x4) |
Audio | Realtek ALC888S-VD, 7.1 HD Audio, Mic-in, Line-out |
Power Input | DC 9V ~ 50V, 3-pin Terminal Block |
Ignition Control | 16-mode software-controlled |
OS Support | Windows 10/11, Linux |
Security & Mgmt. | TPM 2.0, Intel® vPro, TCC, TSN, Wake-on-LAN, PXE, Watchdog |
Operating Temp. | -40°C to 75°C (35W CPU), -40°C to 55°C (65W CPU), Fanless |
Certifications | CE, FCC, EN50155, EN50121-3-2 |
Mounting Options | Wall mount (default), VESA, 2U rack (optional) |
Dimensions | 260mm x 240mm x 79mm |
Weight | 4.5 kg |
COM/SOM
COM/SOM Solutions by Vecow are compact, high-performance embedded modules designed to accelerate development of customized industrial systems. These Computer-on-Module (COM) and System-on-Module (SOM) platforms integrate Intel® or ARM processors, offering scalable computing power for AIoT, robotics, and edge computing. Built for rugged environments, they support wide temperature ranges (-40°C to 85°C), shock/vibration resistance, and low power consumption. With rich interfaces (PCIe, USB, Ethernet) and support for real-time OS/Linux, they enable rapid deployment in smart factories, autonomous vehicles, and medical devices. Vecow’s COM/SOM modules streamline design flexibility, reduce time-to-market, and ensure reliability for mission-critical applications demanding compact, modular architectures.
VCOM-2600
The VCOM-2600 is a high-performance COM Express Compact Type 6 module built around the 11th Gen Intel® Core™ i7/i5 (Tiger Lake UP3) processor. It delivers excellent graphics and computing performance with support for Intel® Iris® Xe Graphics and up to 4 independent display outputs. Featuring a wide -40°C to 85°C operating range, robust I/O options including PCIe Gen 3, USB 3.2, SATA, UARTs, and Intel® I219LM Ethernet with iAMT support, the VCOM-2600 is ideal for industrial, transportation, and edge computing applications.

Technical specifications
Category | Specification |
---|---|
Processor | 11th Gen Intel® Core™ i7-1185G7E / i5-1145G7E (Tiger Lake UP3) |
Graphics | Intel® Iris® Xe Graphics, up to 4 independent displays |
Display Interfaces | Dual-channel 24-bit LVDS, 1 RGB, 3 DDI |
Memory | Up to 2x DDR4 SO-DIMM, 3200MHz |
Storage | 2x SATA III (6Gbps) |
USB Ports | 4x USB 3.2, 8x USB 2.0 |
UART Ports | 2x UART (RX/TX support) |
Ethernet | Intel® I219LM PCIe GbE PHY, supports iAMT |
Audio | Realtek ALC88S-VD codec on baseboard, HAD bus |
Expansion | 1x PCIe x4 (from CPU, not configurable as 4 x1), 4x PCIe x1 |
TPM | Infineon SLB9670, TPM 2.0, SPI Interface (optional) |
HW Monitoring | Temperature and voltage monitoring with auto CPU throttling |
Power Input | ATX: 12V ± 5% / 5Vsb ± 5% or AT: 12V ± 5% |
Operating Temp. | -40°C to 85°C (with fan sink) |
Storage Temp. | -40°C to 85°C |
Humidity | 5% to 95%, non-condensing; Relative: 95% @ 85°C |
Dimensions | 95mm x 95mm (3.74" x 3.74") – COM Express Compact |
Form Factor | PICMG COM.0 Rev 3.0 Type 6 |
Certifications | CE, FCC |
Industrial Motherboards
Vecow’s Industrial Motherboards are rugged, high-reliability computing cores engineered for demanding industrial environments. Built to endure extreme temperatures (-40°C to 85°C), shock, and vibration, these motherboards feature Intel® or ARM processors for robust performance in automation, transportation, and energy sectors. With rich I/O (PCIe, USB, LAN, COM) and support for expansion slots, they enable flexible customization for edge AI, machine vision, and IoT applications. Compliant with industrial standards like MIL-STD and EN 50155, they ensure long-term stability in harsh settings like factories, railways, and smart grids. Vecow’s solutions prioritize scalability, power efficiency, and seamless integration, delivering durable, future-proof computing for mission-critical systems.
Vecow EMBC-7000
The Vecow EMBC-7000 is a rugged 3.5” Embedded Single Board Computer, powered by the latest Intel® Core™ Ultra 14th Gen processors. It combines cutting-edge CPU/GPU/NPU architecture for optimal performance and power efficiency. Designed for industrial and edge AI applications, the EMBC-7000 supports 2.5G LAN, USB 3.2 Gen 2x2, and up to 4 independent displays, including HDMI 2.1, DisplayPort 1.4, and eDP. With a wide operating temperature range of -40°C to 75°C and DC 9V to 55V power input, the EMBC-7000 is perfect for factory automation, intelligent vending, smart retail, and robotic applications.

Technical specifications
Category | Specification |
---|---|
Processor | Intel® Core™ Ultra 7 165U Processor (12 Cores) |
NPU | Intel® AI Boost (11 TOPS AI performance) |
Chipset | Intel® SoC |
BIOS | AMI BIOS |
Memory | 1x DDR5 SO-DIMM, up to 48GB (5600MHz) |
Graphics | Intel® Graphics |
Display Support | 4 Independent Displays: - HDMI 2.1 (Up to 4096x2304 @60Hz) - 2x DisplayPort 1.4 (Up to 4096x2304 @60Hz) - eDP (Up to 3840x2400 @120Hz) |
Ethernet | 2x Intel® I226 2.5GigE LAN (supports TSN) |
Audio | Realtek ALC888S-VD, 7.1 Channel HD Audio, Mic-in, Line-out |
USB Ports | 2x USB 3.2 Type-A, 1x USB 3.2 Gen 2x2 Type-C with Display, 1x USB 2.0 |
Expansion | 1x SUMIT B Connector, 3x M.2 Sockets (PCIe 4.0 x4, x2, USB 3.0, etc.) |
Storage | 1x SATA III (6Gbps), 2x M.2 (PCIe x4, x2) |
Power Input | DC 9V to 55V (ATX Power Connector), Ignition Control (16-mode software) |
TPM | Infineon SLB9672, TPM 2.0, SPI Interface |
Watchdog Timer | Reset: 1 to 255 sec./min. per step |
Temperature | Operating: -40°C to 75°C, Storage: -40°C to 85°C |
Humidity | 5% to 95% non-condensing, 95% at 75°C |
Dimensions | 146.0mm x 102.0mm (5.75" x 4.02") |
Certifications | CE, FCC, ICES |
Industrial Multi-Touch Panel PC/Display
Industrial Multi-Touch Panel PCs/Displays by Vecow are rugged, high-visibility interfaces built for harsh industrial environments. Featuring IP65/66-rated enclosures, anti-scratch glass, and wide-temperature operation (-30°C to 70°C), they withstand dust, moisture, vibrations, and extreme conditions. Powered by Intel® or ARM processors, these panels offer responsive capacitive/projective capacitive touchscreens with sunlight-readable displays for outdoor use. Ideal for factory automation, logistics, and transportation, they support diverse I/O (PoE, USB, COM) and connectivity (Wi-Fi, 5G) for real-time control and HMI applications. Compliant with EN 50155 and MIL-STD standards, Vecow’s solutions ensure reliable, intuitive interaction in smart manufacturing, energy, and mission-critical settings.
MTC-9021W
The MTC-9021W is a robust 21.5" industrial touchscreen panel PC powered by the 11th Gen Intel® Core™ i7/i5/i3 (Tiger Lake UP3) processors. It features a full HD 10-point projected capacitive touch screen and is designed for industrial applications, with a fanless design supporting wide temperature ranges (-5°C to 55°C). The unit also boasts IP65 front panel protection, ensuring durability in challenging environments. This product offers flexible connectivity options with 1 GigE LAN, 2.5G LAN, multiple USB ports, and expansion options through M.2 slots for 5G, WiFi, and storage.

Technical specifications
Category | Specification |
---|---|
Panel | Full HD TFT LED LCD, 21.5" |
Max. Resolution | 1920 x 1080 (Full HD) |
Brightness | 250 cd/m² |
Viewing Angles (H/V) | 178° / 178° |
Contrast Ratio | 3000:1 |
Touch Screen | 10-point Projected Capacitive |
Touch Transparency | ≥ 91% |
Surface Hardness | 7H Surface Hardness |
Control Interface | USB Type |
Processor | Intel® Core™ i7/i5/i3 (Tiger Lake UP3) Quad-Core |
Chipset | Intel® SoC (Tiger Lake UP3) |
Memory | 1 x DDR4 3200MHz SO-DIMM, up to 32GB |
Graphics | Intel® Iris® Xe Graphics |
Serial Ports | 2 x COM RS-232/422/485 (ESD 8kV, DB9 Type) |
USB Ports | 2 x USB 3.1, 2 x USB 2.0 |
Ethernet | 1 x Intel® I219LM GigE, 1 x Intel® I225 2.5 GigE |
Display Ports | 2 x DisplayPort (up to 4096x2304 @60Hz) |
SIM Card | 1 x Internal Nano SIM Card Socket |
Expansion Slots | 1 x M.2 Key B Socket (3042/3052), 1 x M.2 Key E Socket (2230) |
Storage | 1 x SATA III (6Gbps), 1 x M.2 Key B Socket (2260) |
Storage Device | 1 x 2.5" SSD/HDD Kit |
Power Input | 9V to 55V DC-in |
Power Interface | 3-pin Terminal Block (V+, V-, Frame Ground) |
TPM | Infineon SLB9670, TPM 2.0 |
Watchdog Timer | Reset 1 to 255 sec./min. per step |
Smart Management | Wake on LAN, PXE supported |
OS Support | Windows 10, Linux |
Dimensions | 537.8mm x 329.0mm x 77.1mm (21.17" x 12.95" x 3.04") |
Weight | 6.35 kg (13.99 lb) |
Mounting | Panel Mount, VESA Mount (75 x 75, 100 x 100) |
Operating Temp | -5°C to 55°C (23°F to 131°F) |
Storage Temp | -20°C to 60°C (-4°F to 140°F) |
Humidity | 5% to 95% non-condensing |
Shock | IEC 60068-2-27, 20G, Half-sine, 11ms |
EMC Compliance | CE, FCC |