Automated IC Programming System


DP2T Automated IC Programming System

DP2T is the most compact & cost-saving automated programming system. It is able to embed with either one unit of the universal programmer (ProgMaster-S8) to support SPI Flash, EEPROM, MCU, and CPLD…etc. Or All-in-one Programmer (NuProgPlus) to support all devices such as SPI Flash, EEPROM, MCU, CPLD, eMMC & UFS…etc.

DP2T also supports both input & output in Tray or Tape & Reel. With the stable quality & high efficiency, the UPH can easily go up to 1000. Save your budget & lower your labor cost starts from DP2T now.

DP1000-G2 Automated IC Programming System

DP1000-G2, an automated programming system, is the second generation of DP1000, which is extra lightweight and compact compared to DP3000, as the size is 50% smaller!

With the ProgMaster Universal Programmer embedded in DP1000 and different input/output peripherals, the system can provide an overall solution for IC programming. Support all kinds of IC families, such as EEPROM, NAND/ NOR FLASH, and MCU…etc.

The system is embedded with 2 sets of ProgMaster-S8 programmer providing 16 programming sites, which stabilizes the quality and the high throughput.

DP2000 Automated IC Programming System

DP2000 is an automated programming system specially designed for tube/tape in & tape out. The system is equipped with a moving programming module and 4 nozzles to handle pick & placement of IC input, positioning, programming and IC output. With 4 nozzles functioning synchronously with the moving programming module, DP2000 easily achieves high throughput, 3,000UPH. This unique and creative design already obtained a patent.

DP3000-G2 Automated IC Programming System

DP3000-G2 is the second generation of DP3000, a professional automated programming system that supports CSP programming. It supports different input/output peripherals, like the tube, tape, and tray, which provides an overall solution for IC programming. DP3000-G2 supports all kinds of IC families, such as EEPROM, NAND/NOR FLASH, MCU, UFS, eMMC...etc. It is able to embed with 6 sets of ProgMaster-S8 programmer or 6 sets of NuProg-S8A programmer to expand up to 48 programming sites, which will keep the high throughput even when handling the high-density memory, like NAND FLASH.


DP600-A Automated Taping Machine

DP600-A is a new generation Automated taping machine, which is designed to be simple and easy operated; tape width adjustment can be finished within 10 seconds without any tool. DP600-A supports devices packaged in 8~88mm width tape. With advanced characteristics, DP600-A offers the best solution for the manufacturing process.

DP600-M2 Semi-Auto Taping Machine

DP600-M2 is a desktop semi-auto taping machine that is able to work independently; designed to be simple and easy to operate. It has both PSA (Press sensitive adhesive) and heat sealing functions. Support 8~88mm tape width; able to finish adjustment within 10 seconds without any adjustment tool. With advanced characteristics, DP600-M2 offers the best solution for the manufacturing process.

DP900 Automated Repacking System

DP900 is a multi-functional packaging system that integrates tube, tray and tape package equipment which allows versatility and flexibility to meet different packing requirement. It is designed to be fully automatic and each package equipment is modularized as a sub-system for easy configuration and allows efficient work turnaround time. In addition, DP900 supports JEDEC standard tray, various SOP tubes and up to 22” tape reel, which is equipped with different sensors to ensure packaging quality and prevent human or system errors. Optional CCD camera can be added to the system for 2D inspection and ink marker for IC marking. LCD keypad is available for each sub-system to allow easier maintenance and troubleshooting.

Auto Tray-250 Auto Tray Loader

Are you still changing the trays by yourself whenever the tray is fully loaded? Auto Tray-250 is an automatic loader specifically for tray input and output. It can accommodate up to 20 to 25 JEDEC standard trays at once and it can perfectly combine with DediProg's automated IC programming systems, DP1000-G2 and DP3000-G2, or other third party automation. Once the tray is filled up with IC, the trays will exchange automatically, and it will only take about 25 seconds!

Auto Tray-350 Auto Tray Loader

Auto Tray-350 series is specifically for tray input and output, which supports 20 to 25 JEDEC standard trays. The machine can perfectly combine with DediProg's automated IC programming system and support online ink or inkjet marking. Differ from the Auto Tray-250 is that Auto Tray-350 can work independently as tray marker, and is able to save eight setting files of tray condition for ink marking in the embedded memory.

Backup Boot Flash Modules


Backup Boot Flash Module-DIP Socket

The Backup Boot Flash-DIP is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool DIP socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.

The BBF-DIP can be used as emulator by connecting it to the application DIP socket (remove the DIP serial flash on the application) with our BBF cable (included) and DIP cable adaptor. Or the BBF DIP can be used as a programmer for serial flash in DIP packages if used together with SF100.

The Serial Flash can be easily changed manually thanks to the DIP socket or even updated by connecting our SF100 programmer. The SF100 programmer is completely transparent for the application and will offer to developer high flexibility for code trials or update.

Please note that the BBF modules only support 3.3V/2.5V IC.

Backup Boot Flash Module-SO8N(150mil) socket

The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO8N socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.

Backup Boot Flash Module-SO8W(207mil) socket

The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO8W socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.

Backup Boot Flash Module-SO16W(300mil) Socket

The Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the backup SPI Flash inserted in our tool SO16W socket and no more on the Main Serial Flash soldered on board. At the connection on board, the BBF tool will disable automatically the Main Serial Flash that does not need to be unsoldered.

Backup Boot Flash Module-Dual SO8W(207mil) Sockets

The Dual SO8W Backup Boot Flash is an ingenious tool created by DediProg to force the application controller to work automatically on the two backup SPI Flash inserted in our tool SO8W sockets and no more on the two Main Serial Flash soldered on board. At the connection, the BBF tool will disable automatically the two Main Serial Flash that does not need to be unsoldered.

The BBF Dual SO8W tool allows working on two Backup Serial Flash providing that they are controlled by the same SPI bus and two different Chip select in the application board.

Backup Boot Flash Module QUAD-8W Socket

The Backup Boot Flash QUAD (BBF-QUAD-8W) is an ingenious tool created by DediProg to allow the application controller to work on the backup SPI Flash inserted in our tool SO8W socket. It allows the application controller to access the backup SPI Flash with SPI single/Dual/Quad IO mode.

Backup Boot Flash Kit


BBF SO8W(207mil) Socket + SF100 Programmer

The Backup Boot Flash Kit (SO8W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 3 different methods:

  • On the Main Serial flash package soldered on board by using our BBF Test Clip(SO8) (included).
  • On our SMT 1.27mm Pin Header (included) soldered in place of the Main Serial flash footprint for a better stability by using the appropriate BBF cable (included).
  • On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).

BBF SO16W(300mil) Socket + SF100 Programmer

The Backup Boot Flash Kit (SO16W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 2 different methods :

  • On the Main Serial flash package soldered on board by using our SO16W Test Clip (included).
  • On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).BF SO16W(300mil) Socket + SF100 Programmer.

BBF Dual SO8W(207mil) Sockets + SF100 Programmer

The Backup Boot Flash Kit (Dual SO8W) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash tool (included) can be connected to the application by 3 different methods:

  • On the Two Main Serial flash packages soldered on board by using our Dedicated BBF Test Clip (included).
  • On our Two SMT 1.27mm Pin Headers (included) soldered in place of the Two Main Serial flash footprints for a better stability by using the appropriate 2.54mm to 1.27mm cable adaptor-dual header (included)
  • On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).

BBF SO8N(150mil) Socket + SF100 Programmer

The Backup Boot Flash Kit (SO8N) is used as a Serial Flash Emulator for easy code development to reduce your time to market. Our Backup Boot Flash Module (included) can be connected to the application by 2 different methods :

  • On the Main Serial flash package soldered on board by using our SO8 Test Clip (included).
  • On your application 2.54mm (2X5) BBF connector (if application designed with) by using the appropriate BBF cable (included).

UFS IC Readers


UFSProg-CS UFS IC Reader Board

UFSProg Series is a professional reader tool to read and write data in each LUN of UFS IC. With a powerful bridge controller IC, DP7000, UFSProg series can support UFS v2.1 up to Gear 3 speed and USB3.1 Gen1 with UASP high-performance protocol.

UFSProg-CS2 UFS IC Reader

UFSProg-CS2 is a professional reader to read and write data in each LUN of UFS IC. With a powerful bridge controller IC, DP7000, UFSProg-CS2 can support UFS v2.1 up to Gear 3 speed and USB3.1 Gen1 with UASP high-performance protocol.


SMT Sockets


SPI Flash Socket 8 Pin-1

This socket is designed for chips with SO8W 207 mil package. The socket can be soldered directly on the SO8W 207 mil PCB foot print.

SPI Flash Socket 16 Pin

The socket is designed for chips with SO16W 300 mil package. The socket can be soldered directly on the SO16W 300 mil PCB foot print.

SPI Flash Socket 8 Pin

This socket is designed for chips with SO8W 207 mil package. The socket can be soldered directly on the SO8W 207 mil PCB foot print.

Surface Mount TSOP56 Socket

Surface Mount TSOP56 socket is designed to be soldered directly on TSOP56 PCB foot print. With this socket, engineers no longer have to solder or desolder the TSOP56 chips during the development phase.

SPI Flash Socket WSON8 6*8

The socket is designed for chips with WSON8 6*8 mm package. The socket can be soldered directly on the WSON8 6*8 mm PCB foot print.

SPI Flash Socket 8 Pin-150mil

The socket is designed for chips with SO16W 300 mil package. The socket can be soldered directly on the SO16W 300 mil PCB foot print.